This reference is intended to outline Data Circuit’s basic printed circuit board fabrication capabilities. Should you have any questions regarding this information, please feel free to contact Marketing or Engineering.
Topic | Normal Capabilities | Advanced / Special Options/ Request | |||||||||
General: | |||||||||||
Panel Size | 12 x 18 | 16 x 18 | 16 x 21 | ||||||||
14 x 24 | 18 x 24 | 21 x 24 | |||||||||
Number of Layers | 2 to 10 | 12 to 24 | |||||||||
Materials: | |||||||||||
Laminate Types available( IPC 4104 ) | FR-4 Multifunctional( Tg = 140° minimum ) | FR-4 High Tg, ( Tg = 180° )Polyimide, Rogers 4350, Teflon, PolyflonThermagon, GIL Laminates | |||||||||
FOIL types available | Electrodeposited Copper | Rolled Annealed | |||||||||
Copper Elongation | > 6% High Temperature Elongation (HTE) | ||||||||||
Inner Layer: | |||||||||||
Foil weight | ½ ounce, 1 ounce, ¼ ounce | 2 ounce, 3 ounce, 4 ounce | |||||||||
Minimum trace width | 0.006″ | Less than 0.006″ | |||||||||
Minimum spacing | 0.006″ | Less than 0.006″ | |||||||||
Finished trace width tolerance | + 0.001″ for ½ ounce | ||||||||||
Outer Layer: | |||||||||||
Foil weight | ¼ ounce, ⅜ ounce, ½ ounce | 1 ounce, 2 ounce, 3 ounce | |||||||||
Minimum trace width | 0.006″ | Less than 0.006″ | |||||||||
Minimum spacing | 0.006″ | Less than 0.006″ | |||||||||
Finished trace width tolerance | + 0.001″ for ½ ounce | ||||||||||
Copper foil thickness: | |||||||||||
foil ( oz / ft2 ) | ¼ | ⅜ | ½ | 1 | 2 | 3 | 4 | ||||
decimal | 0.250 | 0.375 | 0.500 | 1 | 2 | 3 | 4 | ||||
nominal thickness ( inches) | 0.00035 | 0.00053 | 0.00070 | 0.00140 | 0.00280 | 0.00420 | 0.00560 | ||||
process thickness (inches) | 0.00035 | 0.00053 | 0.00070 | 0.00125 | 0.00255 | 0.00385 | 0.00525 |
Topic | Normal Capabilities | Advanced / Special Options | ||
Dielectric Thickness: | ||||
Minimum overall board thickness (as measured over metal) | 4 layers 0.062″ | 12 layers 0.093″ | 4 layers 0.024″ | 12 layers 0.066″ |
6 layers 0.062″ | 6 layers 0.031″ | 14 layers 0.078″ | ||
8 layers 0.070″ | 8 layers 0.042″ | |||
10 layers 0.070″ | 10 layers 0.054″ | |||
Maximum overall board thickness (as measured over metal) | 0.093″ | 0.250″ | ||
Thickness tolerance | + 10% | Less than + 10% | ||
Minimum dielectric spacing | Cores | Pre-pregs | Cores | Pre-pregs |
0.005″ | 0.004″ | 0.003″ | 0.004″ 0.0025 | |
Holes: | ||||
Minimum drilled hole diameter | 0.0118″ | 0.008″, 0.007”0.0059” (under evaluation) | ||
Maximum drilled hole diameter | 0.126″ | 0.250″ | ||
Aspect Ratio | 4:1 to 6:1 | 7:1 to 10:1 | ||
Plated hole diameter tolerance | Vias up to 0.020″ | + 0.000″ – hole dia | Compliant pin connectors, stake pins + 0.002″ – 0.003″ | |
0.021″ to 0.079″ | + 0.003″ | |||
0.080″ to 0.140″ | + 0.004″ | |||
0.141″ to 0.250″ | + 0.005″ | |||
Unplated drill hole diameter tolerance | 0.020″ to 0.125″ + 0.001″0.126″ to 0.250″ + 0.003″ | |||
Hole to hole location accuracy | + 0.003″ ( datum true position .00849″ ) | |||
Pad Diameters: | ||||
Inner layers ( < 0.008″ core) Tangency:Annular ring requirements:
Plane Clearance: |
Panel dimension > 14″Add 0.012″ to drilled hole diameterAdd 0.015″ to drilled hole diameter for 0.001″ annular ring
Add 0.025″ to drilled hole diameter |
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Inner layers ( above 0.008″ core) Tangency:Annular ring requirements:
Plane Clearance: |
Panel dimension < 14″Add 0.010″ to drilled hole diameterAdd 0.012″ to drilled hole diameter for 0.001″ annular ring or add twice min. annular ring required
Add 0.025″ to drilled hole diameter |
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Outer layersTangency:Annular ring requirements: | Add 0.010″ to drilled hole diameterAdd 0.012″ to drilled hole diameter for 0.001″ annular ring |
Topic | Normal Capabilities | Advanced / Special Options |
Liquid Photo Imageable Solder Mask: | ||
Type | Taiyo PSR 4000 & as required | |
Nominal thickness over trace | 0.0008″ to 0.0012″ | |
Registration tolerance | + 0.003″ | less than + 0.0025″ |
Minimum space required between pads for complete coverage | 0.015″ | 0.009″ |
Resolution – minimum web | 0.005″ | 0.004″ |
Available colors | Green, Clear, Red, Blue, Black | |
Legend: | ||
Type | Hysol thermally cured epoxy ink | |
Smallest line width produced repeatability | 0.008″ | |
Location accuracy | + 0.006″ | |
Available colors | White, Yellow, Red, Orange, Black | |
Routing: | ||
Edge to edge tolerance | + 0.010″ | + 0.005″ |
Edge to datum hole tolerance | + 0.010″ | + 0.005″ |
Routed feature tolerance | + 0.005″ | + 0.003″ |
Routed hole diameter toleranceMaximum:Minimum: | ||
1.250″ + 0.010″ | 1.250″ + 0.005″ | |
0.250″ + 0.005″ | 0.250″ + 0.003″ | |
Minimum internal radius | 0.0155″ | less than + 0.0155″ |
Minimum external radius | None | |
Internal routed location tolerance | + 0.005″ ( datum true position 0.01414″ ) | |
Scoring: | ||
Web thickness tolerance | + 0.003″ | + 0.002″ |
Location tolerance | + 0.010″ | less than + 0.010″ |
Available scoring angle | 30° | |
Minimum web thickness | Varies depending on panel thickness – contact Data Circuits | |
Jump scoring capability | Yes |
Topic | Normal Capabilities | Advanced / Special Options |
Hot Air Solder Leveling: | ||
Vertical HASLSolder deposit thickness range: | 30 – 2000 micro inches | Contact Data Circuits |
Edge Connector Gold Plating: | ||
Hard gold plated over nickel plateNickel plated thickness:Gold plated thickness: | ||
0.000100″ + 20% | Contact Data Circuits | |
0.000040″ + 20% | ||
Edge beveling: | ||
Available angles | 20°, 30°, 40°, 45° | |
Angle tolerance | + 10° | + 5° |
Available depths | 0.015″ to 0.075″ | |
Depth tolerance | + 0.010″ | + 0.005″ |
Electrical test: | ||
Pitch | 0.025″ | 0.020″, 0.016″ &0.005 for flying probe |
Net list capability | Gerber net list extraction | IPC D 356 |
Fixture types | Universal grid | Flying probe |
Resistivity testingOpen resistance:Short resistance: | 5 Ohms minimum2 Mega Ohms minimum, 100 Mega Ohms maximum | |
Test voltages available | 10 to 250 volts | |
Controlled Impedance | + 15% | + 10% |
Miscellaneous: | ||
Warp and twist | 0.010″ per inch | 0.0007″ per inch |
Layer to layer registration | + 0.005″ | Minimum annular ringrequirements |
Track Routing – inner and outer3 Track configuration2 Track configuration | 0.100″ grid pattern0.050″ grid pattern | Contact Data Circuits |
Surface Finish: | Other Technologies: | Laboratory: |
Organic Surface Preparation | Rigid – Flex Circuits | Micro sectioning |
Immersion Gold over Nickel plate | Blind and Buried vias | Volumetric Analysis |
Hot Air Solder Level (HASL) | Sequential Lamination | Coating measurements |
Nickel plate | Radio Frequency product | Ionic Contamination |
Tin plate | Edge Plating | |
Selective Strip | Via Plugging | |
Heat Sink / Metal Cores | ||