This reference is intended to outline Data Circuit’s basic printed circuit board fabrication capabilities. Should you have any questions regarding this information, please feel free to contact Marketing or Engineering.
| Topic | Normal Capabilities | Advanced / Special Options/ Request | |||||||||
| General: | |||||||||||
| Panel Size | 12 x 18 | 16 x 18 | 16 x 21 | ||||||||
| 14 x 24 | 18 x 24 | 21 x 24 | |||||||||
| Number of Layers | 2 to 10 | 12 to 24 | |||||||||
| Materials: | |||||||||||
| Laminate Types available( IPC 4104 ) | FR-4 Multifunctional( Tg = 140° minimum ) | FR-4 High Tg, ( Tg = 180° )Polyimide, Rogers 4350, Teflon, PolyflonThermagon, GIL Laminates | |||||||||
| FOIL types available | Electrodeposited Copper | Rolled Annealed | |||||||||
| Copper Elongation | > 6% High Temperature Elongation (HTE) | ||||||||||
| Inner Layer: | |||||||||||
| Foil weight | ½ ounce, 1 ounce, ¼ ounce | 2 ounce, 3 ounce, 4 ounce | |||||||||
| Minimum trace width | 0.006″ | Less than 0.006″ | |||||||||
| Minimum spacing | 0.006″ | Less than 0.006″ | |||||||||
| Finished trace width tolerance | + 0.001″ for ½ ounce | ||||||||||
| Outer Layer: | |||||||||||
| Foil weight | ¼ ounce, ⅜ ounce, ½ ounce | 1 ounce, 2 ounce, 3 ounce | |||||||||
| Minimum trace width | 0.006″ | Less than 0.006″ | |||||||||
| Minimum spacing | 0.006″ | Less than 0.006″ | |||||||||
| Finished trace width tolerance | + 0.001″ for ½ ounce | ||||||||||
| Copper foil thickness: | |||||||||||
| foil ( oz / ft2 ) | ¼ | ⅜ | ½ | 1 | 2 | 3 | 4 | ||||
| decimal | 0.250 | 0.375 | 0.500 | 1 | 2 | 3 | 4 | ||||
| nominal thickness ( inches) | 0.00035 | 0.00053 | 0.00070 | 0.00140 | 0.00280 | 0.00420 | 0.00560 | ||||
| process thickness (inches) | 0.00035 | 0.00053 | 0.00070 | 0.00125 | 0.00255 | 0.00385 | 0.00525 | ||||
| Topic | Normal Capabilities | Advanced / Special Options | ||
| Dielectric Thickness: | ||||
| Minimum overall board thickness (as measured over metal) | 4 layers 0.062″ | 12 layers 0.093″ | 4 layers 0.024″ | 12 layers 0.066″ |
| 6 layers 0.062″ | 6 layers 0.031″ | 14 layers 0.078″ | ||
| 8 layers 0.070″ | 8 layers 0.042″ | |||
| 10 layers 0.070″ | 10 layers 0.054″ | |||
| Maximum overall board thickness (as measured over metal) | 0.093″ | 0.250″ | ||
| Thickness tolerance | + 10% | Less than + 10% | ||
| Minimum dielectric spacing | Cores | Pre-pregs | Cores | Pre-pregs |
| 0.005″ | 0.004″ | 0.003″ | 0.004″ 0.0025 | |
| Holes: | ||||
| Minimum drilled hole diameter | 0.0118″ | 0.008″, 0.007”0.0059” (under evaluation) | ||
| Maximum drilled hole diameter | 0.126″ | 0.250″ | ||
| Aspect Ratio | 4:1 to 6:1 | 7:1 to 10:1 | ||
| Plated hole diameter tolerance | Vias up to 0.020″ | + 0.000″ – hole dia | Compliant pin connectors, stake pins + 0.002″ – 0.003″ | |
| 0.021″ to 0.079″ | + 0.003″ | |||
| 0.080″ to 0.140″ | + 0.004″ | |||
| 0.141″ to 0.250″ | + 0.005″ | |||
| Unplated drill hole diameter tolerance | 0.020″ to 0.125″ + 0.001″0.126″ to 0.250″ + 0.003″ | |||
| Hole to hole location accuracy | + 0.003″ ( datum true position .00849″ ) | |||
| Pad Diameters: | ||||
| Inner layers ( < 0.008″ core) Tangency:Annular ring requirements:
Plane Clearance: |
Panel dimension > 14″Add 0.012″ to drilled hole diameterAdd 0.015″ to drilled hole diameter for 0.001″ annular ring
Add 0.025″ to drilled hole diameter |
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| Inner layers ( above 0.008″ core) Tangency:Annular ring requirements:
Plane Clearance: |
Panel dimension < 14″Add 0.010″ to drilled hole diameterAdd 0.012″ to drilled hole diameter for 0.001″ annular ring or add twice min. annular ring required
Add 0.025″ to drilled hole diameter |
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| Outer layersTangency:Annular ring requirements: | Add 0.010″ to drilled hole diameterAdd 0.012″ to drilled hole diameter for 0.001″ annular ring | |||
| Topic | Normal Capabilities | Advanced / Special Options |
| Liquid Photo Imageable Solder Mask: | ||
| Type | Taiyo PSR 4000 & as required | |
| Nominal thickness over trace | 0.0008″ to 0.0012″ | |
| Registration tolerance | + 0.003″ | less than + 0.0025″ |
| Minimum space required between pads for complete coverage | 0.015″ | 0.009″ |
| Resolution – minimum web | 0.005″ | 0.004″ |
| Available colors | Green, Clear, Red, Blue, Black | |
| Legend: | ||
| Type | Hysol thermally cured epoxy ink | |
| Smallest line width produced repeatability | 0.008″ | |
| Location accuracy | + 0.006″ | |
| Available colors | White, Yellow, Red, Orange, Black | |
| Routing: | ||
| Edge to edge tolerance | + 0.010″ | + 0.005″ |
| Edge to datum hole tolerance | + 0.010″ | + 0.005″ |
| Routed feature tolerance | + 0.005″ | + 0.003″ |
| Routed hole diameter toleranceMaximum:Minimum: | ||
| 1.250″ + 0.010″ | 1.250″ + 0.005″ | |
| 0.250″ + 0.005″ | 0.250″ + 0.003″ | |
| Minimum internal radius | 0.0155″ | less than + 0.0155″ |
| Minimum external radius | None | |
| Internal routed location tolerance | + 0.005″ ( datum true position 0.01414″ ) | |
| Scoring: | ||
| Web thickness tolerance | + 0.003″ | + 0.002″ |
| Location tolerance | + 0.010″ | less than + 0.010″ |
| Available scoring angle | 30° | |
| Minimum web thickness | Varies depending on panel thickness – contact Data Circuits | |
| Jump scoring capability | Yes | |
| Topic | Normal Capabilities | Advanced / Special Options |
| Hot Air Solder Leveling: | ||
| Vertical HASLSolder deposit thickness range: | 30 – 2000 micro inches | Contact Data Circuits |
| Edge Connector Gold Plating: | ||
| Hard gold plated over nickel plateNickel plated thickness:Gold plated thickness: | ||
| 0.000100″ + 20% | Contact Data Circuits | |
| 0.000040″ + 20% | ||
| Edge beveling: | ||
| Available angles | 20°, 30°, 40°, 45° | |
| Angle tolerance | + 10° | + 5° |
| Available depths | 0.015″ to 0.075″ | |
| Depth tolerance | + 0.010″ | + 0.005″ |
| Electrical test: | ||
| Pitch | 0.025″ | 0.020″, 0.016″ &0.005 for flying probe |
| Net list capability | Gerber net list extraction | IPC D 356 |
| Fixture types | Universal grid | Flying probe |
| Resistivity testingOpen resistance:Short resistance: | 5 Ohms minimum2 Mega Ohms minimum, 100 Mega Ohms maximum | |
| Test voltages available | 10 to 250 volts | |
| Controlled Impedance | + 15% | + 10% |
| Miscellaneous: | ||
| Warp and twist | 0.010″ per inch | 0.0007″ per inch |
| Layer to layer registration | + 0.005″ | Minimum annular ringrequirements |
| Track Routing – inner and outer3 Track configuration2 Track configuration | 0.100″ grid pattern0.050″ grid pattern | Contact Data Circuits |
| Surface Finish: | Other Technologies: | Laboratory: |
| Organic Surface Preparation | Rigid – Flex Circuits | Micro sectioning |
| Immersion Gold over Nickel plate | Blind and Buried vias | Volumetric Analysis |
| Hot Air Solder Level (HASL) | Sequential Lamination | Coating measurements |
| Nickel plate | Radio Frequency product | Ionic Contamination |
| Tin plate | Edge Plating | |
| Selective Strip | Via Plugging | |
| Heat Sink / Metal Cores | ||
