Capablities

This reference is intended to outline Data Circuit’s basic printed circuit board fabrication capabilities. Should you have any questions regarding this information, please feel free to contact Marketing or Engineering.

Topic Normal Capabilities Advanced / Special Options/ Request
General:
Panel Size 12 x 18 16 x 18 16 x 21
14 x 24 18 x 24  21 x 24
Number of Layers 2 to 10 12 to 24
Materials:
Laminate Types available( IPC 4104 ) FR-4 Multifunctional( Tg = 140° minimum ) FR-4 High Tg, ( Tg = 180° )Polyimide, Rogers 4350, Teflon, PolyflonThermagon, GIL Laminates
FOIL types available Electrodeposited Copper Rolled Annealed
Copper Elongation > 6% High Temperature Elongation (HTE)
Inner Layer:
Foil weight ½ ounce, 1 ounce, ¼  ounce 2 ounce, 3 ounce, 4 ounce
Minimum trace width 0.006″ Less than  0.006″
Minimum spacing 0.006″ Less than  0.006″
Finished trace width tolerance + 0.001″ for ½ ounce
Outer Layer:
Foil weight ¼ ounce, ⅜ ounce, ½ ounce 1 ounce, 2 ounce, 3 ounce
Minimum trace width 0.006″ Less than  0.006″
Minimum spacing 0.006″ Less than  0.006″
Finished trace width tolerance + 0.001″ for ½ ounce
Copper foil thickness:
foil ( oz / ft2 ) ¼ ½ 1 2 3 4
decimal 0.250 0.375 0.500 1 2 3 4
nominal thickness ( inches) 0.00035 0.00053 0.00070 0.00140 0.00280 0.00420 0.00560
process thickness (inches) 0.00035 0.00053 0.00070 0.00125 0.00255 0.00385 0.00525
Topic Normal Capabilities Advanced / Special Options
Dielectric Thickness:
Minimum overall board thickness (as measured over metal) 4 layers 0.062″ 12 layers 0.093″ 4 layers 0.024″ 12 layers 0.066″
6 layers 0.062″ 6 layers 0.031″ 14 layers 0.078″
8 layers 0.070″ 8 layers 0.042″
10 layers 0.070″ 10 layers 0.054″
Maximum overall board thickness (as measured over metal) 0.093″ 0.250″
Thickness tolerance + 10% Less than + 10%
Minimum dielectric spacing Cores Pre-pregs Cores Pre-pregs
0.005″ 0.004″ 0.003″ 0.004″ 0.0025
Holes:
Minimum drilled hole diameter 0.0118″  0.008″, 0.007”0.0059” (under evaluation)
Maximum drilled hole diameter 0.126″ 0.250″
Aspect Ratio 4:1 to 6:1 7:1 to 10:1
Plated hole diameter tolerance Vias up to 0.020″ + 0.000″ – hole dia Compliant pin connectors, stake pins + 0.002″  – 0.003″
0.021″ to 0.079″ + 0.003″
0.080″ to 0.140″ + 0.004″
0.141″ to 0.250″ + 0.005″
Unplated drill hole diameter tolerance 0.020″ to 0.125″  + 0.001″0.126″ to  0.250″ + 0.003″
Hole to hole location accuracy + 0.003″  ( datum true position   .00849″ )
Pad Diameters:
Inner layers ( < 0.008″ core)        Tangency:Annular ring requirements:

Plane Clearance:

Panel dimension > 14″Add 0.012″ to drilled hole diameterAdd 0.015″ to drilled hole diameter for 0.001″ annular ring

Add 0.025″ to drilled hole diameter

Inner layers ( above 0.008″ core)       Tangency:Annular ring requirements:

Plane Clearance:

Panel dimension < 14″Add 0.010″ to drilled hole diameterAdd 0.012″ to drilled hole diameter for 0.001″ annular ring or add twice min. annular ring required

Add 0.025″ to drilled hole diameter

Outer layersTangency:Annular ring requirements:  Add 0.010″ to drilled hole diameterAdd 0.012″ to drilled hole diameter for 0.001″ annular ring
Topic Normal Capabilities Advanced / Special Options
Liquid Photo Imageable Solder Mask:
Type Taiyo PSR 4000 & as required
Nominal thickness over trace 0.0008″ to 0.0012″
Registration tolerance + 0.003″ less than + 0.0025″
Minimum space required between pads for complete coverage 0.015″ 0.009″
Resolution – minimum web 0.005″ 0.004″
Available colors Green, Clear, Red, Blue, Black
Legend:
Type Hysol thermally cured epoxy ink
Smallest line width produced repeatability 0.008″
Location accuracy + 0.006″
Available colors White, Yellow, Red, Orange, Black
Routing:
Edge to edge tolerance + 0.010″ + 0.005″
Edge to datum hole tolerance + 0.010″ + 0.005″
Routed feature tolerance + 0.005″ + 0.003″
Routed hole diameter toleranceMaximum:Minimum:
1.250″ + 0.010″ 1.250″ + 0.005″
0.250″ + 0.005″ 0.250″ + 0.003″
Minimum internal radius 0.0155″ less than  + 0.0155″
Minimum external radius None
Internal routed location tolerance + 0.005″ ( datum true position 0.01414″ )
Scoring:
Web thickness tolerance + 0.003″ + 0.002″
Location tolerance + 0.010″ less than  + 0.010″
Available scoring angle 30°
Minimum web thickness Varies depending on panel thickness – contact Data Circuits
Jump scoring capability Yes
Topic Normal Capabilities Advanced / Special Options
Hot Air Solder Leveling:
Vertical HASLSolder deposit thickness range: 30 – 2000 micro inches Contact Data Circuits
Edge Connector Gold Plating:
Hard gold plated over nickel plateNickel plated thickness:Gold plated thickness:
0.000100″ + 20% Contact Data Circuits
0.000040″ + 20%
Edge beveling:
Available angles 20°, 30°, 40°, 45°
Angle tolerance + 10° + 5°
Available depths 0.015″ to 0.075″
Depth tolerance + 0.010″ + 0.005″
Electrical test:
Pitch 0.025″ 0.020″, 0.016″ &0.005 for flying probe
Net list capability Gerber net list extraction IPC D 356
Fixture types Universal grid Flying probe
Resistivity testingOpen resistance:Short resistance:  5 Ohms minimum2 Mega Ohms minimum, 100 Mega Ohms maximum
Test voltages available 10 to 250 volts
Controlled Impedance + 15% + 10%
Miscellaneous:
Warp and twist 0.010″ per inch 0.0007″ per inch
Layer to layer registration + 0.005″ Minimum annular ringrequirements
Track Routing – inner and outer3 Track configuration2 Track configuration  0.100″ grid pattern0.050″ grid pattern  Contact Data Circuits
Surface Finish: Other Technologies: Laboratory:
Organic Surface Preparation Rigid – Flex Circuits Micro sectioning
Immersion Gold over Nickel plate Blind and Buried vias Volumetric Analysis
Hot Air Solder Level (HASL) Sequential Lamination Coating measurements
Nickel plate Radio Frequency product  Ionic Contamination
Tin plate Edge Plating
Selective Strip Via Plugging
Heat Sink / Metal Cores